Dimation Inc. © 2009-2011
An AS9100 Service provider
ITAR Registered. We take it serious about being compliant!
when micro packaging support is required, we have the ANSWER.
If wafer level support is required:
We can provide the following services:
- Wafer dicing up to 8”, special configurations and slivers
- Die Inspection and packaging
- Die Attach
- Wire bond ball and wedge
- Encapsulation
- MCM Packaging
- Monolithic Packaging
- Hybrid Packaging
- PoP Package on Package
