Dimation Inc. © 2009-2011
An AS9100 Service provider
ITAR Registered. We take it serious about being compliant!
If you don’t find something you need assistance with, please don’t hesitate to call.
The capabilities we have listed are just a some of the capabilities we provide. At Dimation we strive to be the best in our industry while providing a variety of offerings.
If you don’t see it listed here, just give us a call and we will see if it is something we can do.
Check out our Capabilities, if not listed here, please give us a call.
Die Level Services
Gold/Aluminum Wedge Bonding
Gold Ball Bonding
ultra fine pitch solutions for < 35um
Chip Scale Packaging
Stacked Die
MCM Packaging
Die Inspection
Wafer Sawing
Waffle Packaging
Custom Packaging
TSOP~QFN~MLF~SOIC
And many others
Class II and III
ANSI/J-STD-001 Certified
Gold/Aluminum Wedge Bonding
Gold Ball Bonding
ultra fine pitch solutions for < 35um
Chip Scale Packaging
Stacked Die
MCM Packaging
Die Inspection
Wafer Sawing
Waffle Packaging
Custom Packaging
TSOP~QFN~MLF~SOIC
And many others
Class II and III
ANSI/J-STD-001 Certified
